发布时间
2026/03/25 04:5812 分钟前源站更新
2026/03/25 04:5812 分钟前首次抓取
2026/03/25 04:5812 分钟前发布时间
12 分钟前源站更新
12 分钟前首次抓取
12 分钟前用于追踪这条内容的来源与记录标识。
Source
原始链接
发布时间
2026/03/25 04:5812 分钟前源站更新
2026/03/25 04:5812 分钟前首次抓取
2026/03/25 04:5812 分钟前发布时间
12 分钟前源站更新
12 分钟前首次抓取
12 分钟前用于追踪这条内容的来源与记录标识。
Source
原始链接
Intel taps industry veteran Seok-Hee Lee to lead foundry packaging push
发布时间
113 天前
2026-06-18 22:01:02 UTC
源站更新
113 天前
2026-06-18 22:01:43 UTC
首次抓取
112 天前
2026-06-19 14:38:00 UTC
英特尔任命半导体行业资深人士、SK 海力士及 SK On 前首席执行官李锡熙为执行副总裁，负责领导其先进封装和后端制造业务，以加强其代工业务的发展。
Intel has appointed semiconductor industry veteran Seok-Hee Lee, former CEO of SK Hynix and SK On, as executive vice president to lead its advanced packaging and back-end manufacturing efforts as the company seeks to boost its contract chip-making business.
用于追踪这条内容的来源与记录标识。
